4300 Lead or Lead-Free Water Washable Solder Paste (250gr jar)

4300 Lead or Lead-Free Water Washable Solder Paste (250gr jar)

Part #: LF4300
Lead Time: 250 Gram Jar In Stock
Data Sheet

The 4300 series offers true multi-process capabilities, ideal for water washable applications, able to be cleaned using standard aqueous cleaning systems without saponification. Utilizes synthetic materials that deliver ideal printing characteristics, unparalleled lot-to-lot consistency and extremely long stencil life. LF-4300 is also VOC and halide-free, and classified as RELO.

  • Synthetic materials
  • Can reflow high temperature alloys up to 300°C
  • Complieswith RoHS directive 2002/95/EC
  • Wide reflow window
  • Excellent wettabilitty compatibility
  • Low voiding and mid-chip beading
Product Description

Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it.

Both the LF-4300 and the 4300 offer true multi-process capabilities, ideal for water washable applications, able to be cleaned using standard aqueous cleaning systems without saponification. Both formulas also utilize synthetic materials that deliver ideal printing characteristics, unparalleled lot-to-lot consistency and extremely long stencil life. LF-4300 and 4300 are also VOC and halide-free, and classified as RELO.


Material Safety Data Sheets (MSDS)
4300 MSDS

Attributes
  • Synthetic materials
  • Can reflow high temperature alloys up to 300°C
  • Complies with RoHS directive 2002/95/EC
  • Excellent wetting compatibility with most PCB finishes
  • Low voiding and mid-chip beading
  • Residue can be left on or removed from the circuit board using water

Product Information
Alloy
  • Sn96.5/Ag3.0/Cu.5
  • Applications
  • Automatic / Manual Printing
  • Automatic / Manual Dispensing
  • Powder Size
  • Type-3
  • Type-5 available upon request
  • Packaging
  • 250 gram jars
  • 500 gram jars upon request
  • Other packaging upon request
  • Stencil Life
  • >8 hrs. @ 30–45% RH & 22–25°C
  • ~4 hrs. @ 45–70% RH & 22–25°C
  • Viscosity
  • Printing applications: 650 to 900Kcps +/-10%
  • Dispensing applications: 400Kcps +/-10%
  • Tested according to IPC-TM-650
  • Tack Value
  • Typical tackiness: 37g force

  • Printing

    The print definition of LF-4300 is ideal for fine pitch applications. The stencil life of this water-soluble product virtually eliminates waste of solder paste from the printed circuit board. This type 3 solder paste will meet pitch requirements from 16 mil to 24 mil.

    Printer Operation

    The following are general guidelines for stencil printer optimization with LF-4300. Some adjustments may be necessary based on your process requirements:

  • Print Speed: 25–100mm/sec
  • Squeegee Pressure: 0.2–0.7kg/inch of blade
  • Under Stencil Wipe: Once every 10–25 prints or as necessary
  • Stencil Cleaning

    Automated stencil cleaning systems for both stencil and misprinted circuit boards. Manual cleaning using water at 60°C or 99% isopropyl alcohol (IPA. Post-reflow cleaning using water at 40-60°C with 30-50 PSI pressure.


    Storage and Handling

    • Refrigerated storage at 42–47°F will prolong the solder paste shelf life to no less than 6 months
    • Syringes & cartridges should be stored vertically with the dispensing tip down.
    • Solder paste should be allowed to reach ambient temperature naturally, prior to use (about 6-8 hours).
    • Never freeze solder paste.

    Heating
    Read the data sheet to find specifications about the recommended temperature profile.

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    PRODUCT PRICING
    Price:  $65.00

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